Chipbond Technology Corporation (6147)
TWSE
Closed
Aug 26, 2026
Day's Range
166.0052 wk Range
50.20Overview - 6147 - Chipbond Technology Corporation
Key Statistics
Valuation
Enterprise Value
121.03B
P/E (Trailing)
‪41.21‬
P/E (Forward)
‪23.24‬
PEG Ratio
‪23.24‬
Price / Sales (TTM)
‪5.39‬
Price / Book
‪2.15‬
EV / EBITDA
‪20.55‬
Profitability
Gross Margin
‪23.46%‬
Profit Margin
‪13.22%‬
Operating Margin
‪19.26%‬
Return on Assets
‪3.28%‬
Return on Equity
‪5.91%‬
Ownership
Shares Outstanding
744.59M
Float
570.08M
Held by Insiders
‪19.44%‬
Held by Institutions
‪19.48%‬
Price stats
Beta
‪1.84‬
50-Day Avg
‪185.97‬
200-Day Avg
‪120.78‬
Dividends
Payout Ratio
‪68.38%‬
Frequency
Annual
Analyst Consensus
6 analysts
Average price target
‪NT$ 230.67‬Market Cap - 6147 - Chipbond Technology Corporation
Peers - 6147 - Chipbond Technology Corporation
Peer Comparison
Compared with companies in Semiconductor Equipment & Materials listed on TWSE.
Profile Summary - 6147 - Chipbond Technology Corporation
About
Chipbond Technology Corporation is a leading provider of semiconductor packaging and testing services, specializing in the manufacture and processing of driver integrated circuits (ICs). Established in 1997 and headquartered in Hsinchu, Taiwan, Chipbond is recognized as the world’s largest display driver IC packaging…
The information on this page is provided for general informational purposes only and is not investment advice.
Market data provided by Twelve Data. Charting by TradingView.
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